Abstract
In recent years, cost-effective compact size devices with high processing speed are made for a sharp rise in the electronics market. To compensate for the high heat fluxes produced in the device, heat sinks are extensively used. In this research, study of active plate heat sink using different slope angle without changing surface area and mass is carried out with the help of CFD tool. The methodology used in this study is the 3D CAD modeling using SOLIDWORKS software and CFD simulation using STAR-CCM+ software. Navier-Stocks equations are solved by using the conjugate heat transfer method. To establish a validation case, the numerical result obtained from this study is compared with the experimental results of the previous research paper. From the results, maximum temperature and thermal resistance performance of 7.5° slope geometry is increased by 1.57% and 16.87% respectively and pressure drop performance of 10° slope geometry is increased by 65.37%. Another considerable factor is the temperature profile at the bottom of the sloped heat sink geometries, which is more uniformly centered in case of 7.5° and 10° slope. The conclusion stated that the angular sloped geometries provides better result than the traditional plate heat sink geometry.
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