Abstract
AbstractBlends of thermosetting (Thermid MC‐600 and Thermid FA‐700) and thermoplastic (UL‐TEM 1000) polyimide resins with different compositions were prepared. Curing and thermal behavior of the blends were investigated using differential scanning calorimetry and dynamic thermogravimetry in a nitrogen atmosphere. The peak exotherm temperature increased with increasing amount of thermoplastic resin, whereas the heat of polymerization decreased. The electrical characteristics of the blends were also investigated using a dielectric analyzer. Dynamic as well as isothermal scans were recorded. Ionic conductivity, permittivity, and the loss factor were measured as a function of temperature at various frequencies. These results showed the complete curing of the resins having 50% Ultem at 225°C in 1 h, whereas Thermid MC‐600 required a postcuring step to observe fully cured resins. A marginal decrease in thermal stability was observed on blending. © 1994 John Wiley & Sons, Inc.
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