Abstract
Direct laser interference patterning (DLIP) is a laser-based surface structuring method that stands out for its high throughput, flexibility and resolution for laboratory and industrial manufacturing. This top-down technique relies on the formation of an interference pattern by overlapping multiple laser beams onto the sample surface and thus producing a periodic texture by melting and/or ablating the material. Driven by the large industrial sectors, DLIP has been extensively used in the last decades to functionalize metallic surfaces, such as steel, aluminium, copper or nickel. Even so, DLIP processing of non-metallic materials has been gaining popularity in promising fields such as photonics, optoelectronics, nanotechnology and biomedicine. This review aims to comprehensively collect the main findings of DLIP structuring of polymers, ceramics, composites, semiconductors and other non-metals and outline their most relevant results. This contribution also presents the mechanisms by which laser radiation interacts with non-metallic materials in the DLIP process and summarizes the developed surface functions and their applications in different fields.
Highlights
1.1 BackgroundIn the last decades, laser sources have become a valuable tool for research environments and for highlyindustrialized processes
This review aims to comprehensively collect the main findings of Direct laser interference patterning (DLIP) structuring of polymers, ceramics, composites, semiconductors and other non-metals and outline their most relevant results
The first polymeric materials structured by DLIP were thermoplastic synthetic polymers with linear structure as films such as polycarbonate (PC), polyimide (PI), polyether ether ketone (PEEK), polyethylene terephthalate (PET), and several polyurethanes (PUs)
Summary
Laser sources have become a valuable tool for research environments and for highlyindustrialized processes. DLIP structuring of non-metallic materials, such as polymers, ceramics or composites, has been gaining attraction in emerging fields like optoelectronics, nanotechnology, biomedical devices and biomaterials [22]. It is the motivation of this review to thoroughly gather the majority of the published works on this topic and sum up their most relevant findings. The physico-chemical mechanisms by which laser radiation interacts with the non-metallic materials in the DLIP process are described along with a summary of the developed surface functions, which are linked to specific applications
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