Structure Thermal Stability and Thermal Stabilization of the Engineering Polyimideand Polysulfone Resins

Abstract

Thermal stability and thermal stabilization of the engineering resins of polyimide and polysulfone types was investigated. It is shown, that polyalkaneimide (PAI) and polysulfone (PSF) degradation in the melt at processing temperature is caused by autooxidation which is responsible for loss of materials performance. Analysis of PAI and PSF degradation and stabilization has allowed us to develop approaches to improve stability of these resins and also solve similar problems of other resins with high heat deflection temperatures, such as polyethersulfone, polysulfones. polyamidoimides, polyetherketones.