Structure and properties of Cu-based alloys diluted by Pd and Ag

Abstract

The microstructure, mechanical and electrical properties of Cu-Pd alloys (with Pd content not more than 8 at.%) and triple Cu-Pd-Ag alloys with 5 at.%Ag were studied. It was established that the strength and the recrystallization temperature of the Cu-Pd alloys increased with palladium content. A comparison of the electrical properties of these alloys when Pd content was increased from 0 to 8 at.%Pd was done. An anomaly was revealed in the Cu-5.9Pd and Cu-8Pd alloys: the plastic deformation does not lead to an increase in the electrical resistivity. It is due to the destruction of short range atomic order in the quenched Cu-Pd alloys under deformation. The alloying with silver leads to a further increase in strength with a constant electrical conductivity. It was found that annealing of the deformed Cu-Pd-Ag alloys at 200-300°C led to an increase in strength. It was shown that the effect was not related to the Pd-content and was due to silver only.