Abstract
In the present work, the gold-nanoplating technique is used to monitor differences in the electrochemical activity of different types of grain boundaries in high-purity copper. Gold-nanoplating is based on the electrochemical displacement of gold, which is deposited as particles from an aqueous solution on the polycrystalline copper surface. The complementary use of electron backscatter diffraction for revealing microstructural features, field emission scanning electron microscopy for imaging, and energy-dispersive X-ray analysis for quantification of the deposited gold makes it possible to detect differences in the grain boundary activity for different types of grain boundaries. In this way, it becomes possible to distinguish special from random boundaries in an efficient way. Also quantitative experimental results on grain boundary activity are produced, which correlate strongly with literature predictions on grain boundary energy.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
