Abstract

The structural and transport properties of thin FePc films of various thickness deposited onto glass substrates have been studied at several temperatures. The structural studies show that the films belong to monoclinic system of β-phase. This structure is confirmed by infrared absorption analysis. The dark electrical resistivity was found to decrease with increasing the film thickness. Graphical representation of log ρ as a function of reciprocal temperature yields two distinct linear parts indicating in turn the existence of two activation energies ΔE 1 and ΔE 2 . Measurement of the thermoelectric power showed that FePc thin films behave as p-type semiconductor over the temperature range 300-450 K. Analysis of thermoelectric power connected with the resistivity results reveals some essential parameters such as: hole mobility μ h 2 x 10 -6 m 2 V -1 s -1 , hole concentration p ≃ 5 x 10 18 m -3 and the ratio c = μ e /μ h ≃ 0.25. Capacitance-voltage data confirm that the Au/FePc interface does not form a Schottky barrier and measurements of the dependence of capacitance on film thickness indicate that the relative permittivity of the films is approximately 3.7. Room temperature current density-voltage characteristics showed ohmic conduction in the lower voltage range and space-charge-limited conductivity (SCLC) in the relatively high voltage. The SCLC controlled by an exponential distribution of traps above the valence band edge. The temperature dependence of current density in accordance with the theory for the exponential trap distributions yielded some essential parameters such as: the hole mobility, the relative permittivity, the trap concentration, the characteristic temperature and the trap density.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.