Structural analysis and resistivity measurements of InAs and GaSb fins on 300 mm Si for vertical (T)FET

Abstract

We report on the uniform selective area growth of InAs and GaSb by metal-organic vapor phase epitaxy on a patterned shallow trench isolation SiO2/Si 300 mm template. High-quality InAs fins are realized via direct InAs nucleation on Si in the trenches. 60° interfacial misfit dislocation arrays formed along the {111} oriented InAs/Si interfaces accommodate most of the lattice mismatch such that threading dislocation generation from residual strain is minimized. GaSb grown on a thick GaAs buffer (partial filling of the trench) suffers from twin formation. The twin density is found to decrease with increasing growth temperature. To maximize the volume of low-defect density material inside the trench, the GaSb growth is initiated as close as possible to the trench bottom. Therefore, uniform high-quality GaSb fins are grown on a very thin low-temperature GaAs and the newly developed InAs seed in the V-groove. High-resolution x-ray diffraction reciprocal space maps show that the InAs and GaSb fins are nearly completely relaxed. The resistivity of undoped and n-doped InAs and undoped and p-doped GaSb fins is measured on as-grown material by micro-4-point-probe without the need for additional complicated device processing. The values are compared to those required for devices as presented in modeling papers. The result is encouraging for the ultra-large-scale integration of vertical nanowire III-V (tunnel) field-effect transistor on 300 mm Si.