Abstract
Interposed films of CdF2, SnF2, PbF2, InF3, or BiF3 can be used to bond vacuum-evaporated gold onto oxide or glass substrates. The fluoride adheres well even when deposited at relatively low temperatures; however, except for SnF2, mp 220 °C, thin (e.g., 300 Å) gold films adhere best when the fluoride-coated substrate temperature is between 120 and 180 °C, at least initially, during gold deposition. For these cases, discontinuous growth for thin gold films is avoided by remaining well below the upper temperature. Thicker gold films (e.g., 2000 Å) adhere well and are continuous at higher temperatures.
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