Abstract
Four points bending tests for Si 3N 4/Cu/S45C joint specimen showed that the bending strengths depend on the residual stresses that originated from joining process. The residual thermal stresses caused an edge sub-interface crack to initiate in the ceramic. The stress intensity factors (SIFs) of the edge sub-interface crack located at distance h from the interface with or without interlayer metal were calculated by the Green's function obtained from a finite element analysis. The crack path at the joint specimen under four points bending loading with the influence of residual stresses was also evaluated by the maximum tensile stress criterion. Finally the effect of residual stress on the crack path was found numerically; the interlayer metal decreases the deflection angle of crack from interface by reducing the residual stress.
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