Stress Intensity Factor for Interface Cracks in Bimaterials Using Complex Variable Meshless Manifold Method

Hongfen Gao,Gaofeng Wei

doi:10.1155/2014/353472

Abstract

This paper describes the application of the complex variable meshless manifold method (CVMMM) to stress intensity factor analyses of structures containing interface cracks between dissimilar materials. A discontinuous function and the near-tip asymptotic displacement functions are added to the CVMMM approximation using the framework of complex variable moving least-squares (CVMLS) approximation. This enables the domain to be modeled by CVMMM without explicitly meshing the crack surfaces. The enriched crack-tip functions are chosen as those that span the asymptotic displacement fields for an interfacial crack. The complex stress intensity factors for bimaterial interfacial cracks were numerically evaluated using the method. Good agreement between the numerical results and the reference solutions for benchmark interfacial crack problems is realized.

Highlights

Composite materials are found in a variety of important structures such as adhesive joints, composite laminates, and electronic and optic components
This paper describes the application of the complex variable meshless manifold method (CVMMM) to stress intensity factor analyses of structures containing interface cracks between dissimilar materials
This work extends the capabilities of the CVMMM to the analysis of cracks that lie at the interface of two elastically homogeneous isotropic materials

Summary

Introduction

Composite materials are found in a variety of important structures such as adhesive joints, composite laminates, and electronic and optic components. Stress intensity factors are important parameters in the investigations of fracture toughness of composite materials. The structural analysis system based on meshless methods to evaluate the fracture mechanics parameters of practical models is developed. Once crack information such as shape, location, and number is added to the model, the stress analysis is performed to evaluate results such as stress, strain, and displacement distribution. Cheng and Li presented complex variable moving least-square approximation in conjunction with meshless for stress intensity factor analysis of an interfacial crack [2]. Interfacial crack modeling within the CVMMM framework is proposed, and a numerical study of the accuracy and robustness of the method is conducted

Interfacial Cracks at Bimaterial

CVMMM for a Bimaterial Interface Crack

Numerical Examples

Concluding Remarks