Abstract

Lateral growth of Ge on insulator was obtained at various annealing temperature by rapid melting growth. The strain distribution of Ge strip was measured with/without SiO2 micro-crucible by micro-Raman. Strain compensating in the Ge stripe between thermal tensile strain and compressive strain were observed. The compressive strain was attributed to the Si-Ge lattice mismatch along the Ge strip. When the Si concentration gradient was lower than ∼3.5%, almost fully-strained Ge strip was obtained. When the Si concentration gradient was larger than ∼3.5%, strain relaxation was observed. The highest average residual compressive strain was about 0.24% in growth region.

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