Abstract
A lead frame based SiC half-bridge power module aimed for automotive applications is proposed. The proposed power module is with features of lightweight and thin thickness by removing the heavy/thick direct bonded copper (DBC) substrate, as well the high loop wire interconnects. Furthermore, the proposed power module is with double side cooling capability. In this study, computational fluid dynamics (CFD) model is created for the proposed power module. Transient/steady thermal simulation and analysis for the power module is carried out. The thermal performance of the power module under operation condition (static simulation) and electric current overshoot condition (transient simulation is evaluated and the effects of different design variables (e.g. materials and components) on the thermal performance of the power module is investigated. The thermally optimized parameters, such as thicker lead frame (LF) and thicker clips, are recommended for the power module for enhancing the thermal performance. However, some special notes need to be taken into consideration for the material selection, such as the epoxy mold compound (EMC) and thermal interface material (TIM) to balance the thermal performance under operation condition and electric current overshoot condition.
Published Version
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