Abstract

Thermal Laser Stimulation (TLS) for static logic state analysis is applied to failure analysis. Three case studies of analyses of the digital logic in an automotive Application Specific Integrated Circuit (ASIC) are discussed. By analyzing the logic states of the circuit we were able to identify the mechanism and localize the site of irregular behavior non-destructively, both for a stuck-at fault and two weak interconnects. The approach measures the power supply current while applying TLS to the device back side. This allows an extremely high analysis coverage, because every transistor is connected to the power supply, making this method a universal tool for every digital circuit failure analysis (FA) workflow, because the gained understanding of the fault allows to replace multiple steps of alternative FA techniques by only a single technique, reducing time and cost for successful FA.

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