Abstract
The spectral resolution of a MEMS-based Infrared (IR) microspectrometer with a plainer grating for projection of dispersed light on a detector array critically depends on the thermal cross-talk between adjacent Thermo-Electric (TE) elements in the array. Bridge-shaped TE detector elements are cut out of a membrane using MEMS process. The air gap between pixels is the cause of the cross-talk. The static and dynamic characterizations of thermal cross-talk have been evaluated, with an emphasis on the effect of the thermal conductivity of air as the function of the package pressure. The developed models accurately predict the behaviour of the thermal cross-talk under different package pressure.
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