Abstract

A method to fabricate silicon-on-insulator (SOI) device sized islands, using Epitaxial Lateral Overgrowth (ELO) from the Selective Epitaxial Growth (SEG) of Silicon, has ≈96.3% stacking fault-free SOI islands when SiO 2 was used as the field insulator. When a nitrided thermal SiO 2 was used ≈99% of the small islands were defect-free. Islands with rounded corners and nitrided oxide had stacking fault defects of less than 500/cm 2.

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