Stabilized filling simulation of microchip encapsulation process

Abstract

The filling process is a key stage of plastic encapsulation, which mainly affects the reliability of chips. This paper presents a stabilized filling simulation method of microchip encapsulation process. In this method, the non-isothermal and incompressible N–S equations coupled with the Kamal curing equation is introduced in as governing equations, and the Castro–Macosko model is employed as the constitutive model of the epoxy molding compound (EMC). The Galerkin/least-squares (GLS)-stabilized finite element method is used to solve the governing equations. With GLS scheme, numerical surge during the solution is relieved and equal order interpolation for velocity field and pressure field is achieved at the same time. A new kind of Euler’s method named piecewise linear interface calculation (PLIC)–flow analysis network (FAN) is proposed to track and describe the flow fronts for each time step. The experimental and numerical results are found to be in good agreement, which proves the accuracy and stabilization of this method.