Stability and dynamic analysis of partially cracked thin orthotropic microplates under thermal environment: an analytical approach

Abstract

An analytical model is proposed to analyze the vibration and buckling problem of partially cracked thin orthotropic microplate in the presence of thermal environment. The differential governing equation for the cracked plate is derived using the classical plate theory in conjunction with the strain gradient theory of elasticity. The crack is modeled using appropriate crack compliance coefficients based on the simplified line spring model. The influence of thermal environment is incorporated in governing equation in form thermal moments and in-plane compressive forces. The governing equation for cracked plate has been solved analytically to get fundamental frequency and central deflection of plate. To demonstrate the accuracy of the present model, few comparison studies are carried out with the published literature. The stability and dynamic characteristics of the cracked plate are studied considering various parameters such as crack length, plate thickness, change in temperature, and internal length scale of microstructure. It has been concluded that the frequency and deflection are affected by crack length, temperature, and internal length scale of microstructure. Furthermore, to study the buckling behavior of cracked plate, the classical relations for critical buckling load and critical buckling temperature is also proposed considering the effect of crack length, temperature, and internal length scale of microstructure.