Abstract
Abstract By combining a hollow-cathode plasma sputter device with the gas aggregation technique, an intense source of nanoscale metal clusters has been developed. Net sputtering rates have been measured as a function of pressure, flow velocity, electric current and cathode geometry, and in most instances they were found to behave differently than their planar-electrode sputtering counterparts. Deposition rates on substrates located away from the hot plasma region have been also measured. Clusters of Cu, Ag, Au and Ta have been produced and their size has been determined via XRD and TEM. The size of Cu n clusters is found to increase with the sputter source discharge current.
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