Abstract

We have developed a source for the production of clusters of refractory metals by plasma sputtering. One aim is to produce metal clusters with a density of ~ 1012 atoms/cm3 in a size range of 102–105 atoms per cluster for the purpose of performing X-ray diffraction studies. Net sputtering rates have been measured for a Cu cathode, as a function of pressure, flow velocity, current, and cathode geometry. Computer simulations of the mass loss from the cathode reproduce the experimental results with reasonable agreement.

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