Abstract
In this paper, we report on the feasibility of depositing Ni–Ti, with Ni-rich composition, thin films at 450°C on polyimide. The films were magnetron co-sputter deposited from Ni–Ti and Ti targets on to three different substrate types: a) polyimide (PI) foils, b) SiO2/Si and c) PI spin coated Si wafers. The crystal structure, surface morphology and microstructure were studied using X-ray diffraction, atomic force microscopy and transmission electron microscopy. A difference in thin film growth mode was observed depending on the substrate. Ni–Ti films deposited on polyimide foil did not show any phase transformation upon thermal cycling. Ni–Ti films deposited on polyimide spin coated wafers showed the expected phase transformation upon thermal cycling.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
