Spot size converter using mask-transfer self-written waveguide method for optical interconnection

Abstract

For the future of optical interconnect, the spot size converter (SSC) device is anticipated to be useful. Hence, we propose SSC using mask-transfer self-written (MTSW) method with UV-curable resin. Mask-transfer provides easy and fast fabrication concept. This makes these technology is a promising technology for SSC device. A prototype fabrication of tapered SSC shape was successfully fabricated due to diffraction effect. From beam propagation method (BPM) simulation, the graph shows that radiation loss decrease as SSC length increase. Comparison between simulation and actual fabricated result shows acceptable value around 0.1–0.2 dB. Thus, these approach is reliable and has potential in the future of optical interconnection.