Abstract
The source-to-drain nonuniformly doped channel (NUDC) MOSFET has been investigated to improve the aggravation of the V/sub th/ lowering characteristics and to prevent the degradation of the current drivability. The basic concept is to change the impurity ions to control the threshold voltage, which are doped uniformly along the channel in the conventional channel MOSFET, to a nonuniform profile of concentration. The MOSFET was fabricated by using the oblique rotating ion implantation technique. As a result, the V/sub th/ lowering at 0.4- mu m gate length of the NUDC MOSFET is drastically suppressed both in the linear region and in the saturation region as compared with that of the conventional channel MOSFET. Also, the maximum carrier mobility at 0.4- mu m gate length is improved by about 20.0%. Furthermore, the drain current is increased by about 20.0% at 0.4- mu m gate length. >
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