Abstract

A novel source-to-drain nonuniformly doped channel (NUDC) MOSFET was investigated theoretically and experimentally. Using an analytical model, it is verified that the mobility of the NUDC MOSFET is increased as compared with that of the conventional channel MOSFET. Also, the V/sub th/ lowering of the NUDC MOSFET is suppressed as compared with that of the conventional channel MOSFET. The NUDC MOSFET was fabricated by the oblique rotating ion implantation technique, and the theoretical predictions were confirmed experimentally. >

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