Abstract
The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved.
Highlights
Wire bonding using gold (Au) wire is still the most preferred interconnection technique for microelectronics packagingM
It is suggested that the combination of finite element analysis to evaluate the effects of friction, applied temperature, bonding power, bonding force and bonding time could provide a more detailed result and assist us to understand the wire bonding mechanism
Each of the techniques that have been introduced leads to different explanations for the Au wire bonding mechanism
Summary
Wire bonding using gold (Au) wire is still the most preferred interconnection technique for microelectronics packagingM. Beside the usage of the footprint morphology method following wire pull and ball shear tests, several researchers have characterised the Au–Al intermetallic compound formed at the interface of the Au ball bond and Al bond pad to elucidate the wire bonding mechanism [6,7,8].
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