Abstract
Low temperature cofired ceramic substrates are becoming increasingly attractive for high density electric circuits and microsystems. Embedded micro patterns such as channels and cavities in ceramic substrates are indispensable for circuit cooling and media transportation. One of process challenges is how to make these embedded micro channels and cavities, which would be collapsed or deformed under conventional lamination. This paper reports on a novel solvent-assisted lamination that could provide low pressure and room temperature lamination of ceramic green tapes. The solvent used in this study was turpentine oil, which demonstrated a proper capability of dissolving polymeric additives on surface of green tapes without obviously changing the distribution of ceramic particles. Procedures for forming embedded micro channels in ceramic green substrates include micro embossing to create open channels, coating of turpentine solvent, followed by low pressure and room temperature lamination. Embedded micro channels with channel width ranging from 25 to 1,000 μm were obtained in ceramic green substrates; Depths of embedded channels shrank by 3–12% versus embossed depths due to turpentine-assisted lamination. The ceramic green substrates with embedded channels were then sintered under a standard cofiring process.
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