Abstract
Micropunching and laser drilling are conventional techniques for patterning microcavities as well as microvias on low temperature cofirable ceramic (LTCC) green tapes. Micro-hot-embossing is, however, an emerging and promising method for fabricating microstructures on prefired ceramic green tapes. This article presents experimental studies of influential process parameters in hot embossing for micropattern formation on LTCC green substrates. By means of dynamic mechanical thermal analysis, the impacts of process temperature and holding time on embossed profiles were studied and their correlation was discussed. When the temperature exceeds a certain range, the organic additives in the LTCC green substrates start to decompose at the isothermal condition, and this loss of organic additives increases the difficulty in embossing. Micropatterns with various dimensional scales, including microchannels, were formed on green ceramic substrates under optimal process parameters, and the patterned ceramic substrates were obtained via sintering.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
