Abstract
Self-propagating exothermic reaction has been developed as a heat source to melt solder alloy during interconnection process for its high combustion heat and short duration. The solidification of solder alloy has occurred in a rapid cooling condition, which would be different from the situation of traditional reflow soldering. In this paper, the self-propagating exothermic reaction of Al/Ni multilayer foil was applied to heat the different types of tin-based solder alloys, the corresponding solidification microstructure has been observed with the focus on fusion zone and the interface between solder and Al/Ni multilayer foil. The result indicates that the thickness of fusion zone is within the range of 150.32~233.10 μm and which is different in Sn, Sn42Bi58, Sn63Pb37 and SAC305 preforms. Moreover, the grains in fusion zone were refined and the unsteady IMCs with small size were generated in fusion zone.
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