Abstract
In this study, an organic–inorganic (O–I) nanohybrid obtained by incorporating an alkoxysilane-functionalized amphiphilic polymer precursor into a SiO2–TiO2 hybrid network was successfully utilized as a buffer layer to fabricate a flexible, transparent, and stable conductive substrate for solution-processed silver nanowires (AgNWs) and graphene under ambient conditions. The resulting O–I nanohybrid sol (denoted as AGPTi) provided a transmittance of the spin-coated AgNWs on an AGPTi-coated glass of 99.4% and high adhesion strength after a 3M tape test, with no visible changes in the AgNWs. In addition, AGPTi acted as a highly functional buffer layer, absorbing the applied pressure between the conductive materials, AgNWs and graphene, and rigid substrate, leading to a significant reduction in sheet resistance. Furthermore, gravure-printed AgNWs and graphene on the AGPTi-based flexible substrate had uniform line widths of 490 ± 15 and 470 ± 12 µm, with 1000-cycle bending durabilities, respectively.
Highlights
Flexible electronic devices, such as displays, energy harvesting systems, memories, sensors, and many more [1,2,3,4,5,6,7], have attracted significant interest
In order to fabricate a flexible conductive substrate based on solution-processed silver nanowires (AgNWs) and graphene, we demonstrate an organic–inorganic (O–I) nanohybrid by incorporating an alkoxysilane-functionalized amphiphilic polymer (AFAP) precursor into a SiO2 –TiO2 hybrid network
In order to investigate the effect of AFAP on the physical and chemical properties of the
Summary
Flexible electronic devices, such as displays, energy harvesting systems, memories, sensors, and many more [1,2,3,4,5,6,7], have attracted significant interest. Intensive studies have led to the development of prototype flexible devices, enabled by the fabrication of novel materials, development of processing techniques, and simulations on the device physics. Future flexible electronics will require solution-based printing processes instead of vacuum and photolithographic processes, which have been widely used in the fabrication of the current electronic devices [10,11,12,13,14,15]. The printing processes enable direct patterning of inks on various substrates (e.g., glass, polymer, metal foil, and paper) without auxiliary deposition and removal of a photoresist, which provides valuable. Significant progress is required in the development of printable materials for flexible electronic devices [16,17,18,19,20]
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