Abstract
A solder technology has been developed that utilizes molten solder surface tension forces to self-assemble MEMS 3-D structures. Using solder, a single batch reflow process can be used to accomplish hundreds or thousands of precision assemblies, and the cost per assembly can be reduced considerably. A model, based on surface energy minimization of molten liquids, has been developed for predicting assembly motion. The modeling, combined with experimental studies, have demonstrated ±2° assembly angle control is possible when the MEMS structures are assembled by solder alone. To improve the self-assembly angle precision, a self-locking mechanism can be added, which reduces the assembly angle variation down to ±0.3°.
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