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Abstract
An attempt to decrease the turnaround time on printed circuit (PC) card design and procurement is discussed. Solder interconnection is a technology designed to reduce the number of card designs. It is beneficial to applications requiring multiplex signal lines and is produced by unique solder mask designs and personalized by use of the surface mount technology (SMT) process. The masks are designed in conjunction with solder interconnects on card surfaces and, with assigned apertures, allow solder to be applied on selected connections. While solder interconnect allows flexibility, its design is critical in order to ensure high reliability, manufacturability, and proper electrical parameters. Hardware has been qualified, manufactured, and tested for these attributes in a SMT process.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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