Abstract
Abstract This contribution presents an original solution for sensor integration into a heat spreader which is directly micromachined into the silicon substrate of the device to be cooled. Having both a high thermal conductivity coefficient and a high level of miniaturization, the vapor chamber heat spreader provides a high robustness due to the absence of any moving pumping parts. Simulation results as well as experimental results obtained with a prototype of the heat spreader with integrated temperature and pressure microsensors are presented. The results concerning device cooling optimization using the integrated sensors are highlighting the interest of this approach for accurate in situ monitoring and cooling optimization of silicon-integrated heat spreaders.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
