Abstract
During tile past few years, SMT has become the buzz word in electronic packaging. When one attends the key conferences, there are generally several sessions devoted to this topic and this is a good sign. The unfortunate situation are the issues discussed namely how great the technology is (no dispute), the benefits it offers user agencies (no dispute), processed and production equipment availability (interesting and varied), etc., etc., etc. It has only been in the last few months that discussions have been held relative to ignored problems. The word problems should not be construed as negative. They are technical issues which require discussion or debate, depending on one's point of view. This is required to establish meaningful guidelines and standards where none now exist. Yet these issues can, by themselves, make the difference between having a successful process and one which has real problems.
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