Abstract
Work carried out in the field of surface-mount technology for aerospace, industrial, and telecommunication applications is discussed. The leadless ceramic chip carrier, a hermetic package for the -55 degrees C-to-+125 degrees C temperature range, is used in military and space applications on either ceramic or advanced printed-wiring board (PWB) interconnects. Research and development on advanced PWBs, multiplane or core structure, using copper-Invar-copper and other composite materials, is discussed. Test results are given, the current status of the technology, and the next steps of research and development are described and some aerospace applications are presented. An evaluation program which utilizes a large test structure on which mounting configurations and different component types can be evaluated is outlined. >
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