Abstract
This paper addresses three main technologies of large scale interconnects that have been evaluated at the Microelectronics Department of Crouzet Aerospace for chip and wire or LCCCs (Leadless Ceramic Chip Carriers). The P/I (Packaging and Interconnect) structures that will be discussed are either ceramic multilayer with MLTF multilayer thick film, and CMC (Cofired Multilayer Ceramic) or advanced PWBs. The paper will present the R&D that has been carried out on MLTF and advanced PWBs and the evaluation programme now in progress for CMC. Test results are given, technology status and next generation interconnects are described and some aerospace applications are presented.
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