Abstract
Thin film technology has become an integral part of semiconductor multichip ceramic packages. Characterizing the thickness of multimetal thin film structures that combine both thin and thick films is an important parameter for manufacturing process control and development.Statistical process control (SPC) is a new requirement for manufacturing processes. Cost is also becoming a crucial factor. "State of the art" multichip ceramic packages built to many levels of thin films are expensive. The fewer parts sacrificed for testing using the standard destructive analytical techniques the more cost effective is the process. Small area, non-destructive thickness measurements on actual product are a must for today and will be even more significant in the future as patterns are reduced in size. Creative and innovative instrumentation and techniques are needed to keep pace with the changing technology. The new and novel micro XRF technique is meeting the challenge "head on".Traditional micro analysis techniques such as SEM-EDX and microprobe involve altering the sample, i.e.
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