Abstract
Chemical mechanical polishing (CMP) has been used in polishing a photomask substrate in flat-panel display (FPD) manufacture. Moreover, the quadrilateral geometry of quartz glass used as the photomask substrate has been enlarged. However, the slurry cannot flow throughout the glass surface evenly owing to the enlarged substrate covering the center of the platen in the polishing process. In this work, we verified the beneficial of spreading slurry into a non-inflow region by the reinforced suction of the slurry supplied to the polishing pad through a hole at center of the platen. A fluorescent agent was used instead of the slurry for flow visualization.
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