Abstract
Molecular dynamics simulations using Reactive Force Field (ReaxFF) are employed to study the silica glass chemical mechanical polishing (CMP) process in aqueous H2O2. The material removal mechanisms in CMP process are studied by analyzing the tribochemical process of silica glass. Results shows that the surface of silica glass is hydroxylated after the reaction with H2O2 solution. Through dehydrogenation and dehydroxylation, the Si-O-Si bridge bonds are formed between abrasive layer and silica glass surface. The chemical bonds between surface atoms and substrate atoms are broken due to the stretch of bridge bonds. The relationship between the sliding speed and the removal of atoms is also studied.
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