Abstract
Slicing silicon ingot is the first step in manufacturing crystalline silicon, the surface quality of silicon wafer affects the workload and cost of subsequent processes. In this paper, a mathematical model of the inner-diameter slicing is presented to investigate the inherent forming mechanism of wafer surface topography in the inner-diameter slicing process. Dynamic model of the inner-diameter saw blade is systematically and detailly established by mathematical formulas. The cutting temperatures, in-plane membrane stresses, transverse deflection, dynamic characteristics of the inner-diameter saw blade are determined analytically. Effects of cutting parameters on the temperature, the stress and transverse deflection of the inner-diameter saw blade are described, natural frequency and dynamic stability of the inner-diameter saw blade in the slicing process are analyzed. Besides, the influences of cutting factors on the surface of the wafer are discussed. The developed mathematical model is meaningful and beneficial to understand the dynamic characteristics and wafer forming mechanism during the slicing process of the inner-diameter saw blade.
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