Six sigma analysis of SMD feeding parameters and board assembly quality

Abstract

PurposeLittle interest has been shown in pickup conditions and parameters and their effect on placement accuracy in the literature before. The purpose of this paper is to find out the possible link between pickup conditions and placement accuracy of typical discrete chip components.Design/methodology/approachA dedicated test board was developed and used to study the ultimate critical pickup conditions. Then the same board was used to find out the best parameters between ultimate conditions and perfect conditions in order to define working limits for good enough pickup that would work well in practice.FindingsThe link between pickup conditions and placement quality was found and converted into measurable controllable values. Additionally, a problem was surprisingly detected in the placement machine's vision performance resulting in inaccuracy, and parameters were re‐defined to avoid this problem in real‐world production. Based on all the findings, the best parameters were defined for component pickup.Originality/valueThis paper discusses the effect of component pickup conditions on accuracy which is seldom handled in the literature. Owing to smaller spacing between chip components in the future, pickup is becoming more important; components will simply have to be picked up more and more on the centre to avoid collision with components already been placed. This paper clearly shows the requirement for placement machine manufacturers to develop more accurate pickup tools for the future.