Characterizing the placement accuracy of a handling unit used for assembling 3D circuit carriers

Abstract

The assembly process of electronic components on three-dimensional circuit carriers increases the requirements on placement machines decisively. Decreased component packages and termination sizes require a precise placement process on 3D substrates with complex geometric structures. For characterizing the quality of this three-dimensional placement process, an evaluation methodology was developed. Therefore 3D test specimens were designed. The placement equipment, that has to be investigated, places components onto these specimens. Afterwards the component positions are analyzed by an optical coordinate measurement machine (CMM) and the placement error is calculated. This paper gives an overview of Molded Interconnect Technology (MID) and introduces the functionality of the investigated placement equipment, an automated multi axis handling unit for assembling 3D-MID. Focus is the presentation of the developed method for characterizing placement equipment used for 3D assembling of MID. Thedesign of the test specimens, the procedure of component placement and of measuring the component position areexplained. The results of characterizing the automated multi axis handling unit are shown. Influences and effects on the placement quality will be discussed. The developed method provides equipment manufacturers and users with a methodology to characterize, specify, document and verify the equipment's placement accuracy.