Abstract

Aluminum nitride (AlN), prized for its high thermal conductivity and electronic insulating properties, finds widespread use in electronic applications, particularly as a substrate material. However, its relatively low fracture toughness limits its application. In this study, to enhance both the thermal and mechanical properties of AlN ceramics, we thoroughly investigate the microstructure, thermal, and mechanical properties of self-reinforced AlN ceramics fabricated by spark plasma sintering, with self-reinforcement achieved through the integration of AlN whiskers within the AlN matrix. Unlike previous studies utilizing conventional pressureless sintering with limited sintering conditions, this work employs spark plasma sintering with a wide range of temperatures (1600–1900°C) and holding times (10–30 min), providing a comprehensive understanding of the sintering behavior. Microstructural features, observed through optical and scanning electron microscopy, reveal distinct toughening mechanisms via crack deflection and branching, with a maximum 20% enhancement. The self-reinforced AlN ceramics exhibit remarkable improvements in thermal conductivity, reaching up to 150Wm−1K−1, surpassing reported values for spark plasma-sintered AlN ceramics. Adding AlN whiskers enhances the thermal and mechanical properties of AlN simultaneously, particularly at 1800°C for 10 min with controlled grain size and nicely integrated AlN whiskers. This work not only contributes valuable insights into the complex relationship between processing parameters, microstructure, and resulting thermal and mechanical properties but also highlights the enhanced thermal and mechanical properties of self-reinforced AlN ceramics.

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