Abstract
Plasma dicing has rapidly gained traction as a viable alternative to conventional blade and laser techniques for wafer singulation. This has been due mostly to the significant benefits plasma dicing delivers in relation to the quality and reliability of devices singulated in this manner. Key to the successful integration of plasma dicing, into the established hierarchy of singulation techniques, is how the ancillary parts of the process flow can be utilized or adapted to accommodate it. More importantly, is the ease at which this can happen and also, how implementation can be achieved in a cost effective manner.
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