Single-Point Grinding of Alumina and Zirconia Ceramics Under Two-Dimensional Compressive Prestress

Abstract

In this study, single-point grinding experiments were performed on alumina and zirconia ceramics to investigate the grinding processes under two-dimensional compressive prestress (TCP). Grinding forces and grooves were measured under different values of TCP to evaluate the grinding defects. The material removal rate and actual grinding depth were exploited to investigate the grinding-induced damage and material removal mechanisms. The results demonstrate that the grinding forces show an increasing tendency with the increasing values of TCP, while the cracks and chipping along the grinding groove edges of both alumina and zirconia ceramics can be reduced. In addition, the material removal rates of both alumina and zirconia ceramics show the same change tendency with the grinding-induced damage for decreasing the actual grinding depth under different values of TCP.