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Abstract
A parametric study of a nonuniform pin–fin-enhanced single-phase microfluidic cooling design for 2.5D stacked integrated circuits (2.5D-SICs) heterogeneous integration is presented. A thin (0.6 mm) coolant manifold has been investigated via full-scale computational fluid dynamics/heat transfer (CFD/HT) simulations. In order to provide thermal management to this heterogeneous chip system, microfin bridges and micropins have been implemented in the manifold. Dielectric coolant polyalphaolefin (PAO) has been investigated, which provides high heat-removal capability, along with thermal isolation between dies. Microfin bridges and wings can provide enhanced thermal performance but with higher pressure drop. Desired maximum temperature limits for high-powered dies are achieved with this 2.5D-SICs liquid cooling design. The effects of chip placement, dimensions of microfin bridges and micropins, and dielectric coolant supply and removal locations within the ultrathin manifold on pressure drop and HT have also been parametrically studied.
Published Version
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