Abstract
A Flip-Bonded Titanium-On-Glass (FBTOG) technology, which combines titanium Inductively-Coupled-Plasma (ICP) deep etching and adhesive wafer bonding technique, was developed to fabricate suspended in-plane high-aspect-ratio bulk titanium microstructures at wafer level. 25μm thick suspended structures with a trench aspect ratio of about 10 are demonstrated. A 2200μm-long comb-drive actuated bulk titanium lateral relay showed a contact resistance of 2.3Ω at a moderate actuation voltage of 30V.
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