Simultaneous measurement of the thermal conductivity and diffusivity of small size elements: application to the characterization of integrated circuit package samples

Abstract

A new method for the simultaneous measurement of thermal conductivity and diffusivity, based on the analysis of the amount of heat which penetrates a sample, has been set up. Two metrological systems for integrated circuit package samples have been miniaturized. The first concerns resin samples and the other ceramic samples. A sensitivity analysis has led to the optimization of the process.