Abstract

The present paper reports results of simulation studies on combined conduction – convection – radiation from two dimensional electronic board equipped with three discrete non identical heat sources. The three non identical heat sources are located across the board. The heat generated in the three heat sources is conducted across the board subsequently getting dissipated by convection and radiation. Air, a radiatively transparent medium, is considered to be the cooling agent. The governing partial differential equations for temperature distribution in the entire computational domain are obtained by appropriate energy balance between the heat generated, convected and radiated. The non linear partial differential equations deduced as above are discretized using finite difference method. The resulting algebraic equations are solved using Gauss - Seidel iterative method. A computer code in C++ is written to solve the problem. A thorough energy balance test and grid study has been performed to freeze on appropriate grid size. The effect of thermal conductivity, surface emissivity and convection heat transfer coefficient on local temperature distribution and maximum temperature distribution of the electronic board are demonstrated exhaustively. Keywords: Surface Radiation, Conduction, Convection, Electronic Board, identical Heat sources.

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