Simulation Research on Micro Contact Based on Force in Silicon Wafer Rotation Grinding

Abstract

Silicon wafer rotation grinding with cup type diamond wheel is a typical ultra precision grinding process. In this paper, a simulation model based on force for micro contact between wheel micro unit and silicon wafer is established from the stable ductile grinding process. Micro contact process in grinding is simulated using the nonlinear explicit finite element analysis software LS-DYNA. The stress-strain results on silicon wafer and wheel micro unit are analyzed by finite element method. The results show that the critical displacement and load corresponding elastic to plastic - plastic to brittle exist on silicon wafer. In silicon plastic zone tangential sliding can produce plastic groove and uplift. Wear of wheel micro unit can be based on the simulation data to judge. The research provides support for wafer grinding and wheel wear mechanism.