Abstract
A unidirectional vertical coupling structure is designed based on optical through-silicon vias (TSVs) and gratings to couple and steer the optical interconnects in 3D optoelectronic integrated circuits. The optical TSVs provide high-speed vertical optical data transmission over short distances. The grating coupler structure achieves efficient coupling between an optical TSV and a planar Si waveguide. Through the action of a mirror that covered the end of the optical TSV cladding and a distributed Bragg reflector(DBR) positioned on the far side away from the waveguide, coupling efficiency of 80% at 1550 nm is obtained in simulations. Our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects and can play an important role in 3D optoelectronic integrated circuits.
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